IMH Inc.

IMH Inc. is specialized in developing and manufacturing heat dissipating substrates for the power electronic industries.

IMH™ (Insulated Metal Heatsink) products provide improved efficiency and reliability compared to ceramic substrates.
With the IMH™ product lineup, we will open a new era of high-performance and high heat dissipation technology.

  • IMH Inc.
  • IMH Inc.
  • IMH Inc.

Technologies & Products

IMH Inc.'s heatsink-integrated heat dissipating substrate technology goes beyond the limitations of existing ceramic substrate technology and provides advanced technologies.

IMH solutions improve reliability and enable excellent thermal management of power semiconductor modules for electric vehicles.

Key features and benefits

1

Excellent performance and reliability
The heat sink-intergrated substrate developed with patented technology provides the highest level of performance and reliability in power electronics applications.

2

Excellent thermal management
Efficient heat dissipation in a variety of applications is possible by using heat sink-intergrated substrates.

3

Cost saving
Simplification of module structure and assembly process improves productivity and reduces costs.

4

Customized solution
Providing customized solutions for customer's requirements.

UNIBODY™

UNIBODY™ is a product lineup with a triple array of electrodes and an integrated heat sink.
The upper electrode layer can be manufactured with a thickness of 2 mm or more.

1

UNIBODY™ AL Pin-Fin
Pin-Fin intergrated substrate & AL housing
Substrate is composed of aluminum base with pin fin processing on the bottom side, dielectric layer and copper electrode.

UNIBODYTM AL Pin-Fin

2

UNIBODY™ Cu Flow-Path
Flow-Path intergrated substrate & AL housing
Substrate is composed copper base with flow-path processing on the bottom side, dielectric layer and copper electrode.

UNIBODYTM CU Flow-Path

3

UNIBODY™ Cu Pin-Fin
Pin-Fin intergrated substrate & AL housing
Substrate is composed of copper base with pin fin on the bottom side, dielectric layer and copper electrode.

UNIBODYTM CU Pin-Fin

Technical support & Inquiry

If you have any questions about our products and technologies, or need a brochure,
please do not hesitate to send a request to the email address below.

E-MAIL : info@imhpe.com

Contact

ADDRESS
(15418) #308, Plant, 107, Jiwon-ro, Danwon-gu, Ansan-si, Gyeonggi-do, Korea
TEL
(82)31-507-0441